CBRHDSH2-100 TR13

CBRHDSH2-100 SURFACE MOUNT HIGH DENSITY 2 AMP SILICON SCHOTTKY BRIDGE RECTIFIER w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CBRHDSH2-100 is a full wave bridge rectifier mounted in a durable epoxy surface mount case, utilizing glass passivated chips. MARKING CODE: CSH10 FEATURES: HD DIP CASE • Device is Halogen Free by design • Low Leakage Current (700nA TYP @ VRRM) • High 2.0A Current Rating • Low VF Schottky Diodes (840mV MAX @ IF=2.0A) MAXIMUM RATINGS: (TA=25°C unless otherwise noted) Peak Repetitive Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Average Forward Current (TA=75°C) Peak Forward Surge Current (8.3ms) SYMBOL UNITS VRRM VR 100 V 100 V VR(RMS) IO 70 V 2.0 A 50 A Operating Junction Temperature IFSM TJ -50 to +125 °C Storage Temperature Tstg -50 to +150 °C ELECTRICAL CHARACTERISTICS PER DIODE: (TA=25°C unless otherwise noted) SYMBOL TEST CONDITIONS TYP MAX UNITS IR VF VR=100V IF=500mA 0.70 4.0 µA 610 mV VF VF IF=1.0A IF=2.0A 700 mV CJ VR=4.0V, f=1.0MHz 770 840 mV 250 pF R4 (19-August 2020) CBRHDSH2-100 SURFACE MOUNT HIGH DENSITY 2 AMP SILICON SCHOTTKY BRIDGE RECTIFIER HD DIP CASE - MECHANICAL OUTLINE SYMBOL A B C D E F G H J K L DIMENSIONS INCHES MILLIMETERS MIN MAX MIN MAX 0.006 0.014 0.15 0.35 0.275 7.00 0.027 0.043 0.70 1.10 0.035 0.051 0.90 1.30 0.090 0.106 2.30 2.70 0.019 0.031 0.50 0.80 0.146 0.165 3.70 4.20 0.051 0.067 1.30 1.70 0.177 0.193 4.50 4.90 0.090 0.106 2.30 2.70 0.000 0.008 0.00 0.20 HD DIP (REV: R3) MARKING CODE: CSH10 R4 (19-August 2020) w w w. c e n t r a l s e m i . c o m CBRHDSH2-100 SURFACE MOUNT HIGH DENSITY 2 AMP SILICON SCHOTTKY BRIDGE RECTIFIER TYPICAL ELECTRICAL CHARACTERISTICS R4 (19-August 2020) w w w. c e n t r a l s e m i . c o m OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time. • Supply management (Customer portals) • Custom bar coding for shipments • Inventory bonding • Custom product packing • Consolidated shipping options DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask. • Free quick ship samples (2nd day air) • Special wafer diffusions • Online technical data and parametric search • PbSn plating options • SPICE models • Package details • Custom electrical curves • Application notes • Environmental regulation compliance • Application and design sample kits • Customer specific screening • Custom product and package development • Up-screening capabilities REQUESTING PRODUCT PLATING 1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when ordering (example: 2N2222A TIN/LEAD). 2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number when ordering (example: 2N2222A PBFREE). CONTACT US Corporate Headquarters & Customer Support Team Central Semiconductor Corp. 145 Adams Avenue Hauppauge, NY 11788 USA Main Tel: (631) 435-1110 Main Fax: (631) 435-1824 Support Team Fax: (631) 435-3388 www.centralsemi.com Worldwide Field Representatives: www.centralsemi.com/wwreps Worldwide Distributors: www.centralsemi.com/wwdistributors For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER, which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms w w w. c e n t r a l s e m i . c o m (001)